Products • Fan Cooling Paste Compound

STARS-700, SILVER GREASE THERMAL COOLING PASTE , Data Accessories, Components and Consumables, EA 1...Maybe more info here

THP-Z3, Deepcool Z3 Thermal Paste Details:High quality thermal paste to provide excellent heat transfer from CPU/GPU to cooler.Specifications: Net Weight 1.5g Operating Temperature -50°C--300°C Color Silver gray Thermal Conductivity >1.134 W/m-K Thermal Impedance <0.201°C-in²/W Dielectric Constant A >5.1 Viscosity 73cps...

SILVGREASE1, Metal Oxide Thermal CPU Paste Compound 1.5g Metal Oxide Thermal CPU Paste Compound Tube for Heatsink...

HTK-002-U1, THERMAL GREASE - HTK HTK-002 - Thermal Compund Silicon material...

HTK-002-U1, THERMAL GREASE - HTK HTK-002 - Thermal Compund Silicon material...

RG-ICV1-TW20-R1, IC-Value V1 thermal compound. High thermal conductivity Low thermal resistance Electrically non-conductive non curing non capacitive non corrosive...

RG-ICV1-TW20-R1, IC-Value V1 thermal compound. High thermal conductivity Low thermal resistance Electrically non-conductive non curing non capacitive non corrosive...

THP-Z3, Deepcool Z3 Thermal Paste Details:High quality thermal paste to provide excellent heat transfer from CPU/GPU to cooler.Specifications: Net Weight 1.5g Operating Temperature -50°C--300°C Color Silver gray Thermal Conductivity >1.134 W/m-K Thermal Impedance <0.201°C-in²/W Dielectric Constant A >5.1 Viscosity 73cps...

THP-Z5, Deepcool Z5 Thermal Paste with 10% Silver Oxide Compounds Details:High quality thermal paste to provide excellent heat transfer from CPU/GPU to cooler.Specifications: Net Weight 3g Operating Temperature -50°C--300°C Color Silver gray Thermal Conductivity >1.46 W/m-K Thermal Impedance <0.159°C-in²/W Dielectric Constant A >6 Viscosity 73cps...

THP-Z5, Deepcool Z5 Thermal Paste with 10% Silver Oxide Compounds Details:High quality thermal paste to provide excellent heat transfer from CPU/GPU to cooler.Specifications: Net Weight 3g Operating Temperature -50°C--300°C Color Silver gray Thermal Conductivity >1.46 W/m-K Thermal Impedance <0.159°C-in²/W Dielectric Constant A >6 Viscosity 73cps...

THP-AS, Artic Silver 5 Thermal Paste 3.5 Gram Compound Details:With its unique high-density fillingof micronised silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Available at Arctic Silver resellers worldwide. Arctic Silver 5 is the reference premium thermal compound. Arctic Silver 5 is optimised for a wide range of bond lines between modern high-power CPUs and high performance heatsinks or water-cooling solutions.Specifications: Thermal Conductance:>350,000W/m2 °C (0.001 inch layer) Thermal Resistance:<0.0045°C-in2/Watt (0.001 inch layer) Average Particle Size:<0.49 microns <0.000020 inch Extended Temperature Limits:Peak: –50°C to >180°C Long Term: –50°C to 130°C Performance:3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode embedded in the CPU core....

RG-ICE2-TA15-R1, IC-Essential E2 thermal compound High thermal conductivity Low thermal resistance Electrically non-conductive non curing non capacitive non corrosive Grease cleanser included...

RG-ICE2-TA15-R1, IC-Essential E2 thermal compound High thermal conductivity Low thermal resistance Electrically non-conductive non curing non capacitive non corrosive Grease cleanser included...

THP-AS, Artic Silver 5 Thermal Paste 3.5 Gram Compound Details:With its unique high-density fillingof micronised silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Available at Arctic Silver resellers worldwide. Arctic Silver 5 is the reference premium thermal compound. Arctic Silver 5 is optimised for a wide range of bond lines between modern high-power CPUs and high performance heatsinks or water-cooling solutions.Specifications: Thermal Conductance:>350,000W/m2 °C (0.001 inch layer) Thermal Resistance:<0.0045°C-in2/Watt (0.001 inch layer) Average Particle Size:<0.49 microns <0.000020 inch Extended Temperature Limits:Peak: –50°C to >180°C Long Term: –50°C to 130°C Performance:3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode embedded in the CPU core....

THP-Z9, Deepcool Z9 High Performance Thermal Paste with 20% Silver Oxide Compounds Details:High quality thermal paste to provide excellent heat transfer from CPU/GPU to cooler.Specifications: Net Weight 3g Operating Temperature -40°C--200°C Color Silver Thermal Conductivity >4 W/m-K Thermal Impedance <0.058°C-in²/W Dielectric Constant A >18.05 Viscosity 89.16cps...

THP-Z9, Deepcool Z9 High Performance Thermal Paste with 20% Silver Oxide Compounds Details:High quality thermal paste to provide excellent heat transfer from CPU/GPU to cooler.Specifications: Net Weight 3g Operating Temperature -40°C--200°C Color Silver Thermal Conductivity >4 W/m-K Thermal Impedance <0.058°C-in²/W Dielectric Constant A >18.05 Viscosity 89.16cps...

CAA-FORMULAX, Antec Formula X Thermal Compound Paste, High Performance Heatsink Paste for All CPU Coolers, High Durability and Easy to Apply - 4 Grams, Antec Formula X High Performance thermal PasteHigh Thermal Conductivity (11 w/mk) , dissipated the heat efficiently which generated from the CPUTop performance suitable for extreme environments (-30~240? and applicationsExceptional long term stability , odorless , non-volatile , non-corrosive , not electrically conductiveWith the modest concentration takes tack-free of good operational experience....

CPARCTICSILVER, Arctic Silver 5 Thermal paste CPU paste, 3.5 gram tube With its unique high-densityfilling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new level of performance and stability. Available at Arctic Silver resellers worldwide. Arctic Silver 5 is the reference premium thermal compound.Arctic Silver 5 is optimized for a wide range of bond lines between modern high-power CPUs and high performance heatsinks or water-cooling solutions.Features:Made With 99.9% Pure SilverHigh-DensityControlled Triple-Phase ViscosityNot Electrically ConductiveAbsolute StabilitySpecifications:Thermal Conductance:>350,000W/m2 (0.001 inch layer)Thermal Resistance:<0.0045-in2/Watt (0.001 inch layer)Average Particle Size:<0.49 microns <0.000020 inchExtended Temperature Limits:Peak: ?50 to >180 Long-Term: ?50 to 130Performance:3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds o...

CAC-TM30, CORSAIR TM30 Performance Thermal Paste 3g. 12 Months Warranty. CORSAIR TM30 thermal pastehelps you push your PC to its limit, with a low-viscosity zinc oxide thermal material that?s easy to apply. TM30?s ultra-low thermal impedance ensures high-efficiency heat transfer between your hardware and cooler, lowering temperatures and allowing for higher clock speeds. Each syringe contains enough TM30 for multiple standard CPU applications, and once installed, TM30 lasts for years with no drying, cracking or thermal degradation. Whether you use liquid or air cooling, CORSAIR TM30 thermal paste is ready to keep your PC cool under pressure and handle the hottest CPUs and GPUs with ease.Premium Zinc Oxide based thermal compound for optimal thermal performance.Install new, or replace existing, thermal compound on your CPU and GPU to improve heat transfer and lower temperatures.Ultra-low thermal impedance lowers CPU temperatures vs common thermal paste.ViscosityThermal ConductivityT...

MGZ-NDSG-N15M-R1, COOLERMASTER MASTERGEL MAKER NANO DIAMOND PARTICLE 1.5G...

MGZ-NDSG-N15M-R1, COOLERMASTER MASTERGEL MAKER NANO DIAMOND PARTICLE 1.5G...

UCS-CPU-TIM=, CISCO (UCS-CPU-TIM=) CPU THERMAL INTERFACE MATERIAL SYRINGE FOR M5 SERVER HS SEAL...